Problem
1. If vertical walled through-wafer structures are made, what is the minimum size and space that can be realized by: (a) DRIE, (b) wet etching and (c) wet etching?
2. The deflection of a circular membrane under pressure is given by h = 0.666 (r 4?p/Et) 1/3, where r is the radius, t the thickness and E the Young's modulus of the diaphragm. What is the deflection that corresponds to a pressure difference of 25 mtorr? What is the corresponding capacitance change?
The response should include a reference list. Double-space, using Times New Roman 12 pnt font, one-inch margins, and APA style of writing and citations.