Problem
Molybdenum etching in Cl2/O2 plasmas results in oxychlorides such as MoOCl4. The etch rate is 300 nm/min, molybdenum film thickness is 300 nm and film non-uniformity and etch process nonuniformity across the wafer are both 5%. The selectivity of Mo:oxide is 20:1. Calculate oxide loss as a function of overetch time.
The response should include a reference list. Double-space, using Times New Roman 12 pnt font, one-inch margins, and APA style of writing and citations.