How far metallic impurities diffuse during thermal oxidation, Chemistry

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How far metallic impurities diffuse during thermal oxidation

Problem

1. How far will metallic impurities diffuse during thermal oxidation?

2. Which is faster, the diffusion of boron or phosphorus?

3. Boron-doped oxide film (200 nm thick, concentration 10²¹/cm³) is deposited on phosphorus-doped wafer (10¹⁵/cm³ phosphorus concentration). What is the junction depth doping after a 300 min, 1100 ^oC diffusion step?

4. What is the magnitude of emitter-push effect?

5. What is the magnitude of OED? Run some simulations to find which process parameters are important.

The response should include a reference list. Double-space, using Times New Roman 12 pnt font, one-inch margins, and APA style of writing and citations.

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