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Simulate releasing 21 toads in a 20×20 enclosed area that does not allow migration. Can you adjust constants to obtain a closer match to the experimental data?
And how the jewish population was blamed for taking french jobs. And the conditions that were present during the roundup.
Describe the selected content and explain the significance of the selected category across all of the religions studied.
Describe specific elements of the works from the chosen artists that represent the multiplicity of the African-American experience.
A cantilever beam of flexural rigidity EI and length l is under a load. Find the beam deflection as a function of the coordinate x from the fixed end.
If the sides of the mask window make an angle of 45o with the directions, determine the length of the side of the pyramid after finishing the etching.
If the natural frequency of the original bell is fp, find the natural frequency of an n - fold increased model that is geometrically similar to the original.
He returns to Earth with the giant and puts it in a cage. By dimensional analysis, describe what happens to the giant ant.
Explain which vaudeville dance style you find the most fascinating.
Using the concept of income elasticity of demand, describe normal, luxury, and inferior goods.
Why must you know the price elasticity of demand to be able to predict the effect of a change in price on total expenditure?
What are the dimensional limitations of the HexSil process? How can you make hemispherical microlenses by moulding/stamping methods?
If 150 mm wafers are specified to have 50 particles of 0.3µm size, what fraction of the wafer area will be non-bonded?
How thick an oxide layer is needed to mask boron implantation? Present your results as a function of boron energy.
How thick a silicon dioxide layer will be formed inside the silicon when the implant dose is 2 × 1018/cm2 in SIMOX?
How far will metallic impurities diffuse during thermal oxidation? What is the magnitude of emitter-push effect?
The wafer is then given 1 h wet oxidation at 1000 oC. All oxide is then etched away. What is the resulting step height in silicon?
How does shadow-mask thickness affect dimensional control? What effect does the contact versus proximitymode operation have, on shadow-mask resolution?
If 340µm deep structures need to be etched and the etch bath temperature is controlled to ±1 oC, what uncertainty does this introduce in the etch time?
What is the difference in making inside versus outside spacers by anisotropic etching? How much etch non-uniformity can native oxide cause in polysilicon RIE?
Molybdenum etching in Cl2/O2 plasmas results in oxychlorides such as MoOCl4. Calculate oxide loss as a function of overetch time.
What is the deflection that corresponds to a pressure difference of 25 mtorr? What is the corresponding capacitance change?
What is the etch or polish selectivity needed in a lowk approach that uses 20 nm thick nitride etch/polishstop layers on 300 nm low-k material?
What is copper plug resistance in 0.1µm technology? What is the breakdown field requirement for low-k dielectrics?
Check with your simulator for sheet resistances, junction depths and film thicknesses. Make sure to select a proper cross section for your 1D simulation.