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bulk defects voids are little regions where there are no atoms and can be thought of as clusters of vacancies impurities can cluster jointly to form
planar defects grain boundaries occur where the crystallographic direction of the lattice abruptly changes this usually happens when two crystals
point defects point defects are defects which are not extended in space in any dimension there is no strict limit for how small a point defect should
what is meant by crystal imperfectionscrystalline solids have a very regular atomic structure that is the local positions of atoms with respect to
define cohesive energycohesive energy can be described as the difference among the average energy of the atoms of a solid especially a crystal and
explain lattice energy the lattice energy of an ionic solid is calculates the strength of bonds in that ionic compound it is given the symbol u and
explain covalent bond a covalent bond is a form of chemical bonding that is characterized by the sharing of pairs of electrons among atoms or among
ionic bondingan ionic bond or electrovalent bond is a type of chemical bond that can often form among metal and non-metal ions or polyatomic ions
hard-bakinghard-baking is the final step in the photolithographic process this step is essential in order to harden the photoresist and better
projection printingprojection printing keep away from mask damage entirely an image of the patterns on the mask is projected onto the resist-coated
proximity printingthe proximity exposure method is same to contact printing except that a small gap 10 to 25 microns wide is maintained among the
contact printingin contact printing the resist-coated silicon wafer is bring into physical contact with the glass photo mask the wafer is held on a
soft-bakingsoft-baking is the step during which almost all of the solvents are separate from the photo resist coating soft-baking plays a very
positive and negative photo resistthere are two types of photo resist positive and negative for positive resists the resist is exposed with uv light
outline a procedure for photolithography in the fabrication of electronic devices what are the limitations of this procedure photolithography
electric susceptibilitythe electric susceptibility chie of a dielectric material is a calculate of how easily it polarizes in response to an electric
polarization of dielectricif a material having polar molecules they will usually be in random orientations when no electric field is applied an
dielectric materials 1 these are the materials in which valence electrons used are bounded very strongly to their parent atoms2 they need very
semi-conducting materials 1 semi-conducting are the materials whose valence electrons are bounded somewhat
bakelite is a material based on the thermosetting phenol formaldehyde resin produced by the reaction under heat and pressure of phenol a toxic
the transformer oil helps cool the transformer because it also gives part of the electrical insulation among internal live parts transformer oil must
what is spheroidsingspheroidsing is the method that applies more to the hypereutectoid steels above 08 c the process includes heating the metal
what are the objectives of annealingannealing is a heat treatment where in a material is altered causing alters in its properties like as strength
what is metallizationmetallization is the fabrication step in which proper interconnection of circuit elements is made aluminum is a popular metal
ion implantation equipment typically having of an ion source where ions of the desired element are produced an accelerator where the ions are