a. In a particular etch process, if selectivity is the biggest concern, which type(s) of etch equipment should be used?
b. If the biggest concern is ion bombardment damage, which typo Ns, of etch equipment should be used?
c. If the biggest concern is obtaining vertical sidewalls, which type(s) of etch equipment should be used?
d. If the biggest concerns are selectivity and vertical sidewalls. which type(s) of etch equipment should be used?
e. What about selectivity and vertical sidewalls and damage, while maintaining reasonable etch rate?