Please calculate the correct solution of the given Problem
Problem- A computer IC chip consumes 10W of power, which is dissipated as heat. The chip measures 4cm by 4 cm on a side and is 0.5cm thick. Currently the IC chip is packaged into an electronic device as shown in the figure below. The base of the chip is in contact with an inert aluminum plate that is 0.3cm thick. The IC chip and its aluminum base are mounted with in a thermally insulating ceramic material, which you may assume to act as a perfect thermal insulator. The top side of the IC chip is exposed to air, which provides a convective heat transfer coefficient of 100W/m2K. The ambient air temperature is maintained at 30C. The chip is operated for a sufficient amount of time that steady-state operation can be assumed. Within the process temperature range of interest, the thermal conductivity of the IC chip material is 1W/mK, and the thermal conductivity of the aluminum is 230W/mK.
Part 1- What is the surface temperature, T1, of the IC chip exposed to the air?
Part 2- What is the temperature, T2, of the IC chip package at the base of the IC chip (x=L1) resting on top of the aluminum plate?
I need expert's assistance to compute the surface temperature.