The device shown is used in the semiconductor industry to polish silicon wafers. The wafers are placed on the faces of the carriers. The outer and inner rings are then rotated causing the wafers to move and rotate against an abrasive surface. If the outer ring rotates in the clockwise direction at 7 rpm and the inner ring rotates in the counterclockwise direction at 12 rpm, what is the angular velocity of the carriers and what is the velocity of C, the center of the top carrier