A 12-inch diameter silicon wafer has a processable area that is circular with a diameter = 11.4 in. The IC chips that will be fabricated on the wafer surface are square with 0.75 in on a side, including an allowance for subsequent chip separation. However, the processable area on each chip is only 0.60 in by 0.60 in. The density of circuits within each chip's processable area is 100,000 circuits per square inch.
(a) How many IC chips can be placed onto the wafer?
(b) Using Rent's Rule with C = 3.8 and m = 0.43, how many input/output terminals (pins) will be needed for each chip package?