DESIGN OF A HEAT SINK FOR A COMPUTER CHIP
A heat sink is to be designed for a hot silicon chip to remove 105.7 W to keep the chip below a maximum temperature of 60 0C. The computer chip is installed inside an enclosure which is open in the front and back with dimensions H10.0xW20.0xL20.0 cm, and cooling is done by a fan blowing air at a velocity of 3.5 m/s at a temperature of 27 0C over the chip. The heat sink is to be designed so that it can fit inside the enclosure with the fins parallel to the direction of airflow.
The following restrictions arc imposed on the design of the heat sink:
- The gap between the fins needs to be at least 4.0 mm.
- The minimum allowable fin thickness is 2.0 mm due to manufacturing constraints.
- Straight rectangular fins are to be used for economic reasons.
The following assumptions are made while designing the heat sink:
- The atmospheric pressure is sea-level standard (101.325 kPa).
- The heat sink will slow down the airflow to 70% of its free stream velocity.
- Thermal resistance due to contact resistance and due to the thickness of the base of the sink is ignored.
- Radiation effects are ignored because the temperature difference is only about 33 oC.
- The maximum temperature of the chip (60 0C) is used as the base temperature of the heat sink.
- Convection coefficient is determined assuming a flat plate circumstance.
Your final report should include at a minimum
- Title page
- Problem statement
- Schematics/ Drawings
- Analysis
- Results
- Conclusion
- References
Hand calculations should be added to the end of the report as an appendix
Problem statement
A heat sink is to be designed for a hot silicon chip to remove 105.7 W to keep the chip below a maximum temperature of 600C.