A circuit board with a dense distribution of integrated circuits (ICs) and the dimensions of 120mm by 120mm on a side is cooled by a parallel flow of atmospheric air with a velocity of 2 m/s.
From wind tunnel tests under the same flow conditions , the average frictional shear stress on the upper surface is determined to be 0.0625N/m^2. What is the allowable power dissipation from the upper surface of the board if the average surface temperature of the ICs must not exceed the ambient air by more than 25 degrees C ?