Advances in very large scale integration of electronic devices on a chip are often restricted by the ability to cool the chip. For mainframe computers, an array of several hundred chips, each of area 25 mm2 , may be mounted on a ceramic substrate. A method of cooling the array is by immersion in a low boiling point fluid, such as refrigerant R-134a. At 1 atm and 247 K, properties of the saturated liquid are µ=1.46 x 10-4 Ns/m2 , cp = 1551 J/kgK, and Pr = 3.2. Assume values of Cs,f = 0.004 and n = 1.7. Estimate the power dissipated by a single chip if it is operating at 50% of the critical heat flux. What is the corresponding value of the chip temperature?