Advances in very large scale integration (VLSI) of elec- tronic devices on a chip are often restricted by the abil- ity to cool the chip. For mainframe computers, an array of several hundred chips, each of area 25 mm2, may be mounted on a ceramic substrate. A method of cooling the array is by immersion in a low boiling point fluid such as refrigerant R-134a. At 1 atm and 247 K, properties of the saturated liquid are µ, = 1.46 X 10-4 N · s/m2, cp = 1551 J/kg · K, and Pr = 3.2. Assume values of Cs, f = 0.004 and n = 1.7.
(a) Estimate the power dissipated by a single chip if it is operating at 50% of the critical heat flux. What is the corresponding value of the chip temperature?
(b) Compute and plot the chip temperature as a function of surface heat flux for 0.25 qs"/q"max 0.90.