We are depositing NiCr fim on a Si wafer for a MEMS device. We measure a stress of the film of 600 MPa using X-Ray diffraction. The film was deposited at 80 C. If there is no externally applied stress ( eg. Deformation), (a)What would the intrinsic stress be? (b)Is it tensile of compressive? (c) How does this compare to thermal stress?