The thickness of photo resist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2050 and 0.2150 micrometers.
a) Determine the cumulative distribution function of photo resist thickness.
b) Determine the proportion of wafers that exceeds 0.2125 micrometers in photo resist thickness.
c) What thickness is exceeded by 10% of the wafers?
d) Determine the mean and variance of photo resist thickness.