Process for printed circuit boards


Two different alloys are being considered for making lead-free solder used in the wave soldering process for printed circuit boards. A crucial characteristic of solder is its melting point, which is known to follow a Normal distribution. A study was conducted using a random sample of 21 pieces of solder made from each of the two alloys. In each sample, the temperature at which each of the 21 pieces melted was determined. The mean and standard deviation of the sample for Alloy 1 were x bar 1 = 218.9ºC and s sub 1 = 2.7ºC; for Alloy 2 the results were x bar 2 = 215.5ºC and s sub 2= 3.6ºC. What is the approximate p-value?

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Basic Statistics: Process for printed circuit boards
Reference No:- TGS0733281

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